It then outlines the key steps in the fabrication process, which includes epitaxial growth on a GaAs wafer, photolithography to pattern mesas, mask etching, dielectric deposition, metallization for contacts, cleaving individual laser facets, and bonding to a heat sink. Damage mechanisms are introduced and common methods and tips on how to avoid damaging your laser through these mechanisms are laid out. Other helpful tips such as the important parameters listed in a specs table and diode packages are discussed. The reflective mirrors, or facets, at the cavity ends of edge-emitting. Following this, we systematically review various micro/nanostructures fabricated by laser techniques, such as laser ablation, laser-induced periodic surface structures (LIPSS), and two-photon polymerization, highlighting their unique properties and fabrication parameters.
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