Lumentum introduced new indium phosphide (InP) photonic chip technologies, including 400 Gbps-per-lane and 200 Gbps-per-lane optical links, along with ultra-high-power lasers for co-packaged optics. • 200G Lens Integrated Photodiode supports flip-chip bonding, improving integration and bandwidth. • Ultra-High-Power 1310 nm DFB lasers support CPO and are featured in NVIDIA Spectrum-X and Quantum-X. These solutions address the twin challenges of bandwidth scaling and power efficiency in AI back-end. SAXONBURG, PA, March 17, 2026 (GLOBE NEWSWIRE) – Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced that it will highlight the breadth and scalability of its Indium Phosphide (InP) innovations at OFC 2026, showcasing a broad comprehensive portfolio of lasers, modulators. Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for optical networks and lasers for industrial and consumer markets) has announced new advancements in foundational indium phosphide (InP) photonic chip technologies designed to deliver higher. Rain Tree Photonics (RTP), has announced the availability of its 200G/lane PIC product family, designed to meet the increasing bandwidth and efficiency demands of AI clusters and hyperscale data centres.